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Inner Layers:
Minimum Core Thickness: 0.003" (Standard: 0.005", 0.008", 0.010", 0.014", 0.018", 0.021", 0.031", 0.036", 0.040", 0.059")
Minimum Dielectric: 0.003" (2 sheets 106 Prepreg) Standard: 0.005" or thicker
Minimum Copper Weight: 0.025" (1/4 oz) Standard: 1oz, 2oz
Prepreg Available: 106 (0.0015"), 1080 (0.0025"), 2313 (0.0035"), 7628 (0.0068")
Technologies:
3 mils Trace and 3 mils Space (Standard: 5 mils Trace and 5 mils Space)
8 mils Smallest Drill Size (Standard: 14.5 mil)
Multilayers with Blind and Buried Vias
Chip on Board
Controlled Impedance (Microstrip, Embedded Microstrip, Stripline, Differential)
Multilayers for Flash Card and PCMCIA applications (Smart Cards)
(8 layers with finished thickness of 0.024 inches Max.)
BGA (Flip Chip)/ Substrate
Bluetooth Cards
Solder Mask/ Legend:
LPI (Liquid Photo Imageable)
Dry Film
Mask Colors: Green, Red, Blue, Black and Clear
Legend Colors: White, Yellow, and Black
Surface Finished:
SMOBC (Solder Mask Over Bare Copper)
White Tin
Bondable Gold
Gold Body (Soft and Hard Gold)
Selective Gold
Tin Immersion
Gold Immersion
Entek OSP
Carbon Ink
Edge Plating
Drilling:
Blind and Buried Vias
Controlled Depth
Minimum Hole size: Standard 0.0145" Smallest, Minimum: 0.008"
Minimum Slot width: 0.025"
Hole Tolerances: Minimum
Sizes Standard Plated Non Plated
<0.040" +/- 0.003" +/- 0.002" +/- 0.001"
0.093">size>0.040" +/- 0.003" +/- 0.002" +/- 0.002"
0.250">size>0.093" +/- 0.005" +/- 0.003" +/- 0.002"
>0.250" +/- 0.005" +/- 0.003" +/- 0.003"
Front to Back Alignment: Standard: 0.003" Minimum 0.0015"
Fabrication:
Tolerance on Overall Dimensions: +/- 0.005"
Minimum inside Radius: 0.015"(Standard: 0.05" using 0.093" rout bit)
Minimum Scoring Depth 0.010"(0.031" Finished Thickness, Standard 0.020" for 0.062")
Beveling, In-Board Beveling
Counter-Sink, Counter-Bore
Edge Milling
Hole Castilation
Testing:
100% Electrical Test with Open and Short
Cad Net-List Testing (IPC356D)
Fixtureless Testing (Flying Probe)
TDR Test (For Controlled Impedance)
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